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IEC 63378-6 Ed. 1.0 b:2026
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  • IEC 63378-6 Ed. 1.0 b:2026

IEC 63378-6 Ed. 1.0 b:2026

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Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

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IEC 63378-6:2026 This part of IEC 63378 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points. This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

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