• New
IEC 63251 Ed. 1.0 b:2023
search
  • IEC 63251 Ed. 1.0 b:2023

IEC 63251 Ed. 1.0 b:2023

$262.00

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Quantity

  Security policy

(edit with the Customer Reassurance module)

  Delivery policy

(edit with the Customer Reassurance module)

  Return policy

(edit with the Customer Reassurance module)

Full Description

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

See more

R00001689
6587 Items
chat Comments (0)
No customer reviews for the moment.