IEC 62899-402-8 Ed. 1.0 en:2026

Full Description

IEC 62899-402-8:2026 This part of IEC 62899 specifies the measurement methods of the dimensions of the shape patterns in printed electronics. These printed patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in IEC TR 62899-402-4 in printed electronics.

NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional
characteristics can be developed later after the measurement methods for vertical variance are established.