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IEC 61189-3-302 Ed. 1.0 b:2025
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
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Full Description
IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated
circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
R00000527
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