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IEC 61189-2-804 Ed. 1.0 b:2023
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Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300
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Full Description
This part of IEC 61189 specifies a test method to determine the time to delamination of base
materials and printed boards using a thermomechanical analyser (TMA). Temperatures used
for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
R00001805
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