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IEC 61189-2-803 Ed. 1.0 b:2023
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  • IEC 61189-2-803 Ed. 1.0 b:2023

IEC 61189-2-803 Ed. 1.0 b:2023

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

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Full Description

This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).

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