IEC 60684-3-281 Ed. 2.0 b:2025

Full Description

This part of IEC 60684 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1.

This sleeving has been found suitable for use up to temperatures of 100 °C.
– Type A: Thin wall Internal diameter up to 195,0 mm typically
– Type B: Medium wall Internal diameter up to 120,0 mm typically

Since these types of sleevings cover a significantly large range of sizes and wall thicknesses, Annex A provides guidance on the range of sizes available. The actual size will be agreed between the user and the supplier.